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Qualification

Qualification Reliability Testing

Stress Test	Stress Conditions	Stress Duration	Failure Criteria
Room Temperature Operating Life (RTOL)	25。C, IF = max DC (Note 1)	1000 hours	Note 2
Wet High Temperature Operating Life (WHTOL)	85。C/60%RH, IF = max DC (Note 1)	1000 hours	Note 2
Wet High Temperature Storage Life (WHTSL)	85。C/85 %RH, non-operating	1000 hours	Note 2
High Temperature Storage Life(HTSL)	110。C, non-operating	1000 hours	Note 2
Low Temperature Storage Life (LTSL)	-40。C, non-operating	1000 hours	Note 2
Non-operating Temperature Cycle (TMCL)	-40。C TO 120。C, 30 min. dwell, <5 min. transfer	200 cycles	Note 2
Non-operating Thermal Shock (TMSK)	-40。C TO 120。C, 20 min. dwell,<20 sec.. transfer	200 cycles	Note 2
Mechanical Shock	1500G, 0.5 msec. pulse, 5 shocks each 6 axis		Notes 3
Natural Drop	On concrete from 1.2m, 3X		Notes
Variable Vibration Frequency	10-2000-10 Hz, log or linear sweep rate, 20G about 1 min, 1.5mm,3X/axis
Solder heat Resistance (SHR)	260。C ± 5。C, 10 sec		Note 3
Solderability	Steam age for 16 hrs., then solder dip at 260。C for 5 sec.		Solder coverage on lead

Notes:
1. Depending on the maximum derating curve.
2. Criteria for judging failure

Item	Test Condition	Criteria for Judgment
Item	Test Condition	Min.	Max.
Forward Voltage (VF)	IF = max DC	-	Initial Level x 1.1
Luminous Flux or Radiometric Power (ΦV)	IF = max DC	Initial Level x 0.7	-
Reverse Current (IR)	VR = 5V	-	50 μA

The test is performed after the LED is cooled down to the room temperature
3. A failure is an LED that is open or shorted.

PDF Download : QUALIFICATION.pdf

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