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Reflow Soldering Condition

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Reflow Soldering Condition

Reflow Soldering Condition – IPC / JEDEC J – STD – 020C

Profile Feature	Sn-Pb Eutectic Assembly	Lead (Pb) – Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)	3 °C / second max.	3 °C / second max.
Preheat
- Temperature Min (Tsmax)	100 °C	150 °C
- Temperature Max (Tsmax)	150 °C	200 °C
- Time (tsmin to tsmax)	60-120 seconds	60-180 seconds
Time maintained above
- Temperature (TL)		217 °C
- Temperature (TL)	183 °C	60-150 seconds
Peak / Classification Temperature	60-150 seconds 240 °C	260 °C
Ramp-Down Rate	6 °C / seconds max.	6 °C / seconds max.
Time 25。C to Peak Temperature	6 minutes max.	8 minutes max.

All temperature refer to topside of the package, measured on the package body surface.

Repairing should not be done after the LEDs have been soldered. When repairin g is unavoidable, a heat plate should be
　 used. It should be confirmed beforehand whether the characteristics of LEDs will or will not be damaged by repairing.

Reflow soldering should not be done more than two times.

When soldering, do not put stress on th e LEDs during heating.

After soldering, do not warp the circuit board.

PDF Download : REFLOW_SOLDERING_CONDITION.pdf