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Qualification  
   
Qualification Reliability Testing  
Stress Test
Stress Conditions
Stress
Duration
Failure
Criteria
Room Temperature Operating Life (RTOL)
25。C, IF = max DC (Note 1)
1000 hours
Note 2
Wet High Temperature Operating Life (WHTOL)
85。C/60%RH, IF = max DC (Note 1)
1000 hours
Note 2
Wet High Temperature Storage Life (WHTSL)
85。C/85 %RH, non-operating
1000 hours
Note 2
High Temperature Storage Life(HTSL)
110。C, non-operating
1000 hours
Note 2
Low Temperature Storage Life (LTSL)
-40。C, non-operating
1000 hours
Note 2
Non-operating Temperature Cycle (TMCL)
-40。C TO 120。C, 30 min. dwell, <5 min. transfer
200 cycles
Note 2
Non-operating Thermal Shock (TMSK)
-40。C TO 120。C, 20 min. dwell,<20 sec.. transfer
200 cycles
Note 2
Mechanical Shock
1500G, 0.5 msec. pulse, 5 shocks each 6 axis
Notes 3
Natural Drop
On concrete from 1.2m, 3X
Notes
Variable Vibration Frequency
10-2000-10 Hz, log or linear sweep
rate, 20G about 1 min, 1.5mm,3X/axis
Solder heat Resistance (SHR)
260。C ± 5。C, 10 sec
 
Note 3
Solderability
Steam age for 16 hrs., then solder
dip at 260。C for 5 sec.
 
Solder coverage
on lead
 
Notes:
1. Depending on the maximum derating curve.
2. Criteria for judging failure
Item
Test Condition
Criteria for Judgment
Min.
Max.
Forward Voltage (VF)
IF = max DC
-
Initial Level x 1.1
Luminous Flux or Radiometric Power (ΦV)
IF = max DC
Initial Level x 0.7
-
Reverse Current (IR)
VR = 5V
-
50 μA
  • The test is performed after the LED is cooled down to the room temperature
    3. A failure is an LED that is open or shorted.
  •  
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