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Reflow Soldering Condition  
   
Reflow Soldering Condition – IPC / JEDEC J – STD – 020C
Profile Feature
Sn-Pb Eutectic Assembly
Lead (Pb) – Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
3 °C / second max.
3 °C / second max.
Preheat
- Temperature Min (Tsmax)
100 °C
150 °C
- Temperature Max (Tsmax)
150 °C
200 °C
- Time (tsmin to tsmax)
60-120 seconds
60-180 seconds
Time maintained above
- Temperature (TL)
217 °C
- Temperature (TL)
183 °C
60-150 seconds
Peak / Classification Temperature
60-150 seconds 240 °C
260 °C
Ramp-Down Rate
6 °C / seconds max.
6 °C / seconds max.
Time 25。C to Peak Temperature
6 minutes max.
8 minutes max.
  • All temperature refer to topside of the package, measured on the package body surface.
  • Repairing should not be done after the LEDs have been soldered. When repairin g is unavoidable, a heat plate should be
    　 used. It should be confirmed beforehand whether the characteristics of LEDs will or will not be damaged by repairing.
  • Reflow soldering should not be done more than two times.
  • When soldering, do not put stress on th e LEDs during heating.
  • After soldering, do not warp the circuit board.
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     PDF Download : REFLOW_SOLDERING_CONDITION.pdf
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